Digi XBee 4 BLU Development Kit
Complete Digi XBee 3 BLU development platform to integrate compact, flexible Bluetooth Low Energy connectivity for IoT devices
The Digi XBee® 3 BLU Development Kit offer an easy-to-use Bluetooth® development platform for designers, OEMs and solution providers supporting Bluetooth 5.4 Low Energy for industrial wireless IoT connectivity. The module supports an industrial temperature range of −40 ºC to 85 ºC (−40 ºF to 185 ºF) making it robust for a variety of industrial applications.
The pre-certified modules comes in the classic XBee form factors (MMT and through-hole) offering MicroPython programmability, beaconing, Bluetooth sensor support and the Digi XBee Mobile App to accelerate use in industrial wireless projects.
Pre-certified modules and tools for development
The pre-certified modules offer MicroPython programmability, beaconing, Bluetooth sensor support and the Digi XBee Mobile App to accelerate use in industrial wireless projects.
Los marcos API y comandos AT estándar de Digi XBee , así como MicroPython y Digi XBee Studio, facilitan la instalación, configuración y prueba de módulos o la actualización de su funcionalidad.
Digi XBee Bluetooth Low Energy modules are a key offering in the Digi XBee ecosystem of wireless modules, adapters, tools and software — all engineered to accelerate product and application development, deployment and management.
Built-in Digi TrustFence® security, identity and data privacy features use multiple layers of control to protect against new and evolving cyber threats. Bluetooth Low Energy also adds security via pairing & bonding, encrypted advertising along with existing XBee security including secure boot, hardware cryptographic acceleration and true random number generation.
Experiencia demostrada y apoyo de expertos
Our decades of embedded experience and millions of deployed devices tell our story; Digi is a trusted solutions provider dedicated to simplifying the way OEMs design, build, deploy and maintain secure connected products.
Digi Wireless Design Services (WDS) provides additional connectivity integration support, certification assistance, and custom design and build services to get your products to market smarter and faster, and support you wherever you are along your development path.
Principales características, ventajas y aplicaciones
- Designed for a range of use cases, from maker projects to industrial applications
- Industrial-rated on a Bluetooth module
- Programabilidad integrada de MicroPython para la computación de borde
- Bluetooth® Low Energy for beaconing, connecting to sensors and local configuration using the Digi XBee Mobile app
- Easily detect modules and connect to smart devices
- Bajo consumo de energía optimizado para una larga duración de la batería
- Integrado con el marco de seguridad Digi TrustFence
- Manage, configure and test with Digi XBee Studio
- Accelerate development with Digi IoT Mobile SDK
- Digi XBee API functionality and support
- Over-the-air (OTA) firmware updates with the Digi XBee Mobile app
- Complete Bluetooth Low Energy 5.4 software stack
El kit incluye:
- (2) Digi XBee 3 BLU modules: chip antenna, u.fl antenna
- (1-2) XBIB interface board
- (1) Antenna (u.fl connector)
- Digi XBee Studio and Digi XBee Tools
- Additional documentation and examples
Digi XBee 3 BLU Development Kit
Especificaciones |
Digi XBee 3 BLU |
RENDIMIENTO DEL BLUETOOTH |
CHIPSET TRANSCEPTOR |
SoC EFR32MG de Silicon Labs |
BLUETOOTH LOW ENERGY VERSION |
Supports Bluetooth Low Energy 5.4 and capable of interoperating with Bluetooth Low Energy 5.4 devices that support 1M and 2M PHY |
MAXIMUM RF DATA RATE |
1 Mbps with 1M PHY and 2 Mbps with 2M PHY |
GAMA INTERIOR/URBANA* |
Hasta 15 m (49 pies) |
ALCANCE DE LA LÍNEA DE VISIÓN EXTERIOR/RF* |
Hasta 300 m (984 pies) |
TRANSMITIR ENERGÍA |
+8 dBm |
SENSIBILIDAD DEL RECEPTOR (1% POR) |
−97 dBm |
CARACTERÍSTICAS |
INTERFAZ DE DATOS EN SERIE |
UART, SPI |
MÉTODO DE CONFIGURACIÓN |
Comandos API o AT, locales o por aire (OTA) |
BANDA DE FRECUENCIAS |
ISM 2,4 GHz |
FACTOR DE FORMA |
Micro (MMT), through-hole (TH) |
INMUNIDAD A LAS INTERFERENCIAS |
FSK (Frequency-shift keying) |
ENTRADAS ADC |
(4) Entradas ADC de 10 bits |
E/S DIGITALES |
13 |
OPCIONES DE ANTENA |
Micro: U.FL antenna, RF pad, chip antenna
Through-hole: PCB antenna, U.FL connector |
TEMPERATURA DE FUNCIONAMIENTO |
-40 ºC a 85 ºC (-40 ºF a 185 ºF) |
DIMENSIONES (L X A X H) |
Micro: 13 mm x 19 mm x 2 mm (0.533 in x 0.76 in x 0.087 in)
Through-hole: 2.438 cm x 2.761 cm (0.96 in x 1.087 in) |
MEMORIA |
1 MB / 96 kB de RAM |
REDES Y SEGURIDAD |
PROTOCOLO |
Bluetooth Low Energy 5.4 |
ENCRYPTION |
AES de 128/256 bits |
ENTREGA FIABLE DE PAQUETES |
Reintentos/reconocimientos |
IDS |
ID y direcciones de PAN, ID de clúster y puntos finales (opcional) |
CANALES |
40 channels |
SEGURIDAD |
Digi TrustFence security with secure boot and protected JTAG |
HERRAMIENTAS DE CONFIGURACIÓN |
Digi XBee Studio and Digi XBee Mobile App |
EMBEDDED PROGRAMMABILITY/td> |
MicroPython |
REQUISITOS DE ENERGÍA |
TENSIÓN DE ALIMENTACIÓN |
1.71 - 3.8 V |
TRANSMITIR LA CORRIENTE |
32 mA a 3,3 V, +8 dBm |
RECIBIR LA CORRIENTE |
13.5 mA |
IDLE CURRENT |
7.5 mA |
CORRIENTE DE SUEÑO |
8 µA a 25 ºC (77 ºF) |
AUTORIZACIONES REGLAMENTARIAS Y DEL TRANSPORTISTA** |
FCC, IC (AMÉRICA DEL NORTE) |
Completa |
ETSI (EUROPA) |
Completa |
GARANTÍA |
GARANTÍA DEL PRODUCTO |
1 año |
Las cifras de alcance estimadas se basan en un terreno al aire libre con fuentes de interferencia limitadas. El alcance real variará en función de la potencia de transmisión, la orientación del transmisor y el receptor, la altura de la antena transmisora, la altura de la antena receptora, las condiciones meteorológicas, las fuentes de interferencia en la zona y el terreno entre el receptor y el transmisor, incluidas las estructuras interiores y exteriores como paredes, árboles, edificios, colinas y montañas.
**Visite
las certificaciones de los productos para conocer las últimas actualizaciones.